PICMG has ratified the COM-HPC 1.2 computer-on-module specification, which introduces the COM-HPC Mini form factor. “This provides high-performance capabilities in a small form factor, measuring only ...
PICMG’s COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor, announced in June 2022. The consortium for the development of open embedded computing ...
As the industry prepares for the computing demands of increased connectivity in vehicles, factories and homes, the PCI Industrial Computer Manufacturers Group (PICMG) is able to provide an update on ...
PCOM-B8800 with PCOM-C8800 COM-HPC Evaluation Carrier Board Packs Server-Class Computing Power and AI Acceleration into Compact Package for Edge Applications PCOM-B8800 is a compact yet rugged and ...
The computer-on-module industry is about to launch another product lifecycle that will create a new performance class after ETX/XTX and COM Express. Say hello to COM-HPC. Computer-on-modules (COMs) ...
Today CPC (Colder Products Company) introduced its new PLQ2 high-performance thermoplastic connector. These QDs deliver new capabilities in tensile strength, creep resistance and temperature handling ...
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