HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond Electronics to ...

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design ...

United Microelectronics (NYSE:UMC) and Cadence Design Systems (NASDAQ:CDNS) collaborate on the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, certified for UMC’s chip stacking ...