An oscilloscope and a device under test (DUT) constitute a de-facto system. In it, the most overlooked element is the interface between the two: the oscilloscope’s probes. Test personnel simply grab ...

Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies ...

Over the past decade, demand for nano-electrical characterization has rapidly increased due to the continuous miniaturization of electronic devices. The semiconductor and microelectronics industries ...

A capacitor measured with a $100 handheld multi-meter can give a substantially different result than the same capacitor measured with a $10,000 LCR meter. That same capacitor measured with two ...

Capacitive sensor technology has evolved markedly over recent years, underpinned by advancements in integrated circuit design and novel measurement approaches. These sensors function by detecting ...

Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for ...

During the manufacture of semiconductor wafers, thickness measurement forms an important part of this process, since it provides process engineers with the information required to ensure that ...

AMS has announced a configurable capacitive sensing front end which allows speed and resolution to be traded to optimise designs. Called PCap04, it can capture and digitise 50,000 times per second at ...