Semiconductor Engineering

Design Flow Challenged By 3D-IC Process, Thermal Variation

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
EDN

Magma’s Talus IC Implementation System Included in TSMC Reference Flow 10.0 Targeting 28-nm Process Technology

Magma(r) Design Automation Inc. (Nasdaq:LAVA – News), a provider of chip design software, today announced that the Talus(r) IC implementation system has been included in TSMC Reference Flow 10.0. With ...
Business Wire

Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a node-to-node design migration flow based on the Cadence ® Virtuoso ® Design ...
Semiconductor Engineering

Lower Resistance Protects Against Failure In IC Design

When you’re fighting off a threat, you typically want all the resistance you can muster. In IC design, on the other hand, minimizing resistance is crucial to success in power structure design. As ...
Digi Times

AI-based EDA tools increasingly crucial for IC design process

With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products has become the core ...
EDN

Introducing the Integrated Circuit (IC) Design Cycle

The process of designing, manufacturing, and testing ICs is complex and exhaustive. The main contributors are the design and verification teams, IP vendors, and IC manufacturers. The process of ...