The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

For the most part, we’ve all been doing integrated circuit (IC) and system-on-chip (SoC) layout the same way for decades. Designers put together the design, be it intellectual property (IP), block, or ...

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

The global semiconductor market reached US$575.1 billion in 2022, but the figure only covers the IC design and IDM sectors. The entire semiconductor value chain should come close... Taiwan's IC design ...