NEWARK, CA--(Marketwired - Jan 27, 2015) - SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash ...

Goepel electronic has announced the introduction of its Module/DIMM244so, a member of the company’s CION product family. The new module is serially controlled via a boundary-scan TAP, and it enables ...

TAIPEI, TAIWAN--(Marketwired - May 04, 2016) - Innodisk, the service-driven flash and DRAM module provider, introduces a brand new DDR4 Mini DIMM DRAM that is fully compliant with ATCA (Advanced ...

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other ...

Mini-ITX motherboard are some of the most exciting in the enthusiast market, and for the past few generations only one brand has been making Intel high-end desktop (HEDT) mini-ITX motherboards; ASRock ...

NEWARK, CA--(Marketwired - May 22, 2014) - SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash ...

OK, after becoming a 'Pod Person' I now see some value in Macs'. However, I have to be able to get 'under the hood' of anything I buy. I can't find any inside shots of the box.<BR><BR>Does anyone know ...

As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. GEEKOM continues to fill out its portfolio of mini ...

NEWARK, CA--(Marketwired - Oct 19, 2015) - SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash ...

Goepel electronic’s Module/DIMM244so, a member of the company’s CION product family, is serially controlled via a boundary-scan test-access port (TAP), and it enables the testing of all signal and ...

Ideal solution for ruggedized telecom and networking applications requiring high-density in a small form factor exposed to harsh environmental conditions. NEWARK, Calif., Feb. 12, 2020 (GLOBE NEWSWIRE ...