Austin, Nov. 26, 2025 (GLOBE NEWSWIRE) -- Transistor Outline (TO) Package Market Size & Growth Insights: According to the SNS Insider,“The Transistor Outline (TO) Package Market size was valued at USD ...
This application note provides guidelines for the handling and assembly of Freescale’s Heat Sink Small Outline Package (HSOP) and Power Quad Flat Package (PQFP) during printed circuit board (PCB) ...
In power supply design, reducing physical size while improving conversion efficiency is a sort of Holy Grail. The payoff for success is a potentially smaller overall system design, complemented by ...
IXYS has announced the expansion of its standard rectifier module portfolio for diode phase-legs in the Y4 package (34mm) outline. IXYS announced the expansion of its standard rectifier module ...
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