Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today announces shipping of its PS5018-E18 ...
A new memory technology company, Crossbar, has broken cover with a new ReRAM design it claims will allow for commercialization of the technology. The company's claims aren't strictly theoretical; ...
‘The ability to store upwards of 20 to 30 hours of HD video on what equates to the size of a pinky fingernail is what you can do with our 176-layer technology. Additionally, the capability exists to ...
The success of NAND flash memory in the semiconductor market is mainly driven by continuous and tremendous growth in the mobile phone and tablet PC markets, and the growth of adoption of high ...
Micron's new fifth-generation 176-layer 3D NAND flash is the same height as its 64-layer memory, but packs in 2.75 times more layers in the same space--a space that's 30% smaller than today's leading ...
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