Most automated quality inspection technologies involve machine vision systems and, increasingly, aspects of artificial intelligence-powered software to speed the identification of part defects. But ...

For the best results with SAM systems, pay close attention to both the digitizer characteristics and the signal path. Automated inspection techniques are widely used in the semiconductor industry for ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

Traditional ultrasonic imaging systems usually transmit broadband ultrasonic pulses through the full sample volume under study. By analyzing these pulses, researchers can measure sample thickness, ...

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...

Motivated by the limitations of scanning approaches to photoacoustic microscopy, an international group supervised by Emmanuel Bossy of Université Grenoble Alpes experimented with structured ...

The capability of acoustic microscopes to image and analyze internal features, including structural defects, recently has been enhanced by technology that puts any number of acoustic microscopes in ...

Brief history of microscopy -- Definitions, attributes of visibility and general principles -- Simple and compound light microscopes -- Compound microscopes using reflected light -- Microscopy with ...