NXP Semiconductors N.V. announced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) ...

For a number of years now we have seen leadless DFN packages (discrete, flat, no-leads) for discrete components which, compared to conventional SMD packages, do away with contact and assembly ...

CISSOID's CHT-NMOS8001 is an N-channel MOSFET guaranteed for operation from -55°C up to +225°C. It is available in a tiny thin dual flat pack (TDFP) hermetically-sealed Ceramic SMD package, as small ...

Nexperia has revealed that key parts from its SOT23-packaged family of high-performance, general-purpose transistors and switching diodes are now fully-specified for operation up to 175°C. Included in ...

Devon-based power supply maker TDK-Lambda has patented a space and cost-saving method of heat-sinking power components. In particular, it applies to a daughter-board with mixed surface-mount (SMD) and ...