Please be aware that this is a beta release. Beta means that the product may not be functionally or feature complete. At this early phase the product is not yet expected to fully meet the quality, ...
Abstract: A novel chip stacking method with low thermal resistance for 3D integration of a large number of memory chips and processor chips is proposed, namely Massive Orthogonal Stacking Assembly of ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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